Title:
Exploring CopprLink & the Future Towards Electro-Optical Interconnects for Evolving Rack Architectures in Data Centers
Session Handouts Available Upon Speaker Approval:
1
Description:
The PCI-SIG announced the CopprLink specification this year and created the opportunity for platform designers to develop new architectures that take advantage of the extended physical reach and new spacing constraints that cabling solutions offer. The recent PCI-SIG 6.0 and 7.0 performance targets help evaluate the types of cabling solutions that can be used, along with when and how the transition to optical solutions is likely to occur.
Beyond theoretical topology studies, this effort will dive-deep into the performance capabilities of SFF-TA-1016 and SFF-TA-1032 solutions, which have been adopted by PCI-SIG as the standard for CopprLink. The paper will combine efforts from a prominent silicon and interconnect providers using both simulation models and real-world silicon and cable assemblies.
To extend the compute network even further, a transition to fiber may be inevitable. This paper will explore the options for creating a viable ecosystem where copper and optical solutions work together to provide attractive architectural advantages. The overall goal of this paper is to present the audience with a clear understanding of what has been happening with PCIe cabling in the last 12mos and prepare them with the tools and information that will carry into future system deployments.
Type:
Technical Paper Session